Capabilities

Avanti Circuits is a full service printed circuit board manufacturer. Below is a list of Avanti Circuits PCB manufacturing capabilities.  Avanti Circuits accepts PCB files in Gerber 274X file format and all PCB files should be sent in a zip-format and sending a readme file is recommended: We are a circuit board manufacturer specializing in high quality PCB prototype and production with quick turnaround. Obtain a custom quote by going to Request Custom Quote.

Layer Count
0-24 Layers
Materials
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Stiffeners
Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide
Final Thickness
2 Layer – Min .005” Max .250” 14 Layer – Min .054” Max .250”
4 Layer – Min .015” Max .250” 16 Layer – Min .062” Max .250”
6 Layer – Min .025” Max .250” 18 Layer – Min .093” Max .250”
8 Layer – Min .031” Max .250” 20 Layer – Min .125” Max .250”
10 Layer – Min .040” Max .250” 22 Layer – Min .125” Max .250”
12 Layer – Min .047” Max .250” 24 Layer – Min .125” Max .250”
Core Thickness
Min .0025”
Maximum Board Size
2 Layer 18” x 28” Mulitlayer 16” x 26”
Finish Plating
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold  and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Finished Copper – Outer Layers
1oz Cu – Min .004” Trace/Space 4oz Cu – Min .010” Trace/Space
2oz Cu – Min .005” Trace Space 5oz Cu – Min .012” Trace/Space
3oz Cu – Min .008” Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004” Trace/Space 3oz Cu – Min .010” Trace/Space
1oz Cu – Min .005” Trace/Space 4oz Cu – Min .012” Trace/Space
2oz Cu – Min .006” Trace/Space
Inner Layer Clearances
Min .008”
Minimum Finished Hole Size
Final Thickness <=.062” – .006’ Hole Final Thickness .150” – .014” Hole
Final Thickness .093” – .010” Hole Final Thickness .200” – .018” Hole
Final Thickness .125” – .012” Hole Final Thickness .250” – .020” Hole
Gold Fingers
1 to 4 edges
Soldermask Type
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Soldermask Colors
Green/Green Matte White
Black/Black Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink LPI Ink
Silkscreen Colors
White Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue
CNC Functions
Scoring Edge to Edge Plated Counterbores
Skip Scoring – .250” Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other Services
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Soldermask Plugged Vias Via Caps (Soldermask)
Conductive Filled Vias
Quality and Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
Tolerances
PTH Hole Size – +/- .002” Front to Back – +/- .002”
NPTH Hole Size – +/- .001” Soldermask – +/- .002”
Tooling Holes – +/- .001” Hole to Pad – +/- .005”
Avanti Circuits Inc.
17650 North 25th Avenue Phoenix, AZ, 85023 USA 
 • 602-866-7227