PCB Manufacturing Departments

Engineering and Cam Area

4 Apollo CAM Workstations
3 Genesis CAM Workstations
1 Checkmate II Drill Programmer
1 Micro modifier
1 EIE PHOTO PLOTTER
1 Kodamatic 710 Film Processor
1 Cimnet Integrated
MFG Software System		 • FR-4 (Tg =135′, 145′, 170′ C)
• N4000-13 (modified epoxy)
• Rogers Duroids & & Teflons
• Getek, BT Epoxy, Polyimides


ML LAMINATION AREA

1 Custom Black Oxide Line
1 Wabash 4 Opening Vacuum Press
1 Wabash 2 Opening Press
2 PHI 2 Opening Presses
1 Circuit Machine Model 7500 Saw
1 Multiline Pinning System		 • Min Board Thickness: 0.005”
• Max Board Thickness: 0.250”
• Min Core Thickness: 2.5 mils
• Min Prepreg Thickness: 2.0 mils
• Thickness Tolerance: +/- 10%


DRILL AREA

1 Tennsmith 48” Power Shear
2 Barnaby Stackmaster
1 Excellon MK-6 Drill
1 Excellon MK-5 Drill
2 Excellon XL-5 Drill
1 Chemcut Model 547 Deburr System		 • Size: PTH +/- 3 mils,
NPTH +/- 2 mils
• Specific Tooling Holes: +/- 1 mil


IMAGING AREA

1 Somaca Scrubber
3 Dry Film Laminators
2 Colight Exposure units
1 ORC 5 KW Exposure Unit
1 Multiline Thin Core Punch
1 VCM Vertical Developer		 • Layer to Layer + – 3 mils
• Front to Back: +/- 2 mils
• Soldermask: +/- 2 mils
• Hole to Pad: +/- 5 mils
(I/L tangency)
• Hole to Pad: +/- 5 mils
(O/L tangency)


PLATING AREA

1 Eidschun Shadow Line
1 Custom Copper Plating Line
1 Marseco Etcher
1 Custom Dry Film Stripping Line
1 Custom Tin Lead Stripping Line


SOLDERMASK AND LEGEND AREA

3 Precision Screening Tables
1 Gyrex LPI Soldermask Sprayer
1 DP-10 Soldermask
Screening Unit
1 Soldermask Exposure Unit
1 Chemcut Model 547 Scrubber
3 Soldermask Curing Ovens
2 VCM Vertical Developer		 • Per IPC-SM-840
• LPI Types: Probimer
77 & Taiyo PSR4000
• Wet Types: Dexter SR-1000
& SR-1020
• Solder Mask Colors: green, Blue,
Red, Clear, Black & White
• Legend Colors: White, Black & Yellow


SURFACE FINISH AREA

1 Hot Oil Reflow Line
1 Hot Air Leveling Line
1 Deep Gold Panel Planting Plating Line
1 Electroless Ni / Au Immersion Line
1 Immersion Tin Line		 • SMOBC
(soldermask over bare copper)
• HASL (hot air solder leveling)
• Fused Tin/ Lead Plating
• Electroless Nickel / Immersion Gold
• Electrolytic Nickel / Gold
• Immersion Tin (Omikron)
• Carbon Ink: 20 OHMS


FABRICATION AREA

3XL-3 Driller Pouters
3 Barnaby Scoring Machines
1 Acuscore CNC Scoring Machine
1 Bevel master
1 Marseco Final Clean Machine		 • Routing: Individual
or Panelized Array
• Scoring: Profiles &
Route/ Score Combinations
• Countersinks, Counterbores,
Beveling & Edge Mining
• Board Edge & Slots:
Plated & Non-plated


INSPECTION AND TEST

4 Inspection Work Stations
1 Camtek 2V50P AOI
2 Bausch & Lomb Stereo Microscopes
1 LIXI X-ray Unit
1 Beta Back Scatter Measurement Unit
1 Comac Board Dryer
3 Mania Flying Probe Testers
1 Trace 924 Single Access Tester
1 Everett Charles 9090 Dual Access Tester		 • Net List Testing per IPC-356D
• Test Voltage: 100-250-volts
• Continuity Resistance: 10-20 ohms
• Isolation Resistance:
2-30 megaohms
• Minimum SMT Pitch: 0.5 mm


ANALYSIS LABORATORY

1 Complete Wet Analysis Laboratory
1 Complete Micro Section Laboratory
1 Perkins-Elmer AA Spectrophotometer
1 Versamet
2 1000X Microscope


SUPPORT AREA

1 Memtek Water Management System
1 Simpson Sludge Filter Press
1 Sulliar 50 HP Air Compressor
1 Worthington 30 HP Air Compressor
1 LeRoi 40 HP Air Compressor
1 Ingersoll-Rand 75 HP Air Compressor		 • 1 Trane 15 Ton Air Chiller
• 1 RSD 15 Ton Air Cooling Tower
• 2 Spencer 15 HP Vacuum Systems


BOARD TYPES

Type II Single & Double Sided
Type III Multilayer through 24 layers Blind & Buried Vias
Plugged Vias (Conductive Ink)
Minimum Finished Via Size: ): 0.006”
Maximum Hole Aspect Ratio: 12:1
Minimum Line Width: 0.004”
Minimum Spacing: 0.004”		 • Edge to Edge +/- 5 mils
• Tooling Holes to Edge +/- 4 mils


Avanti Circuits Inc.
17650 North 25th Avenue Phoenix, AZ, 85023 USA 
 • 602-866-7227