PCB Manufacturing Departments
Engineering and Cam Area
- 4 Apollo CAM Workstations
- 3 Genesis CAM Workstations
- 1 Checkmate II Drill Programmer
- 1 Micro modifier
- 1 EIE PHOTO PLOTTER
- 1 Kodamatic 710 Film Processor
- 1 Cimnet Integrated
- MFG Software System
- FR-4 (Tg =135′, 145′, 170′ C)
- N4000-13 (modified epoxy)
- Rogers Duroids & & Teflons
- Getek, BT Epoxy, Polyimides
ML Lamination Area
- 1 Custom Black Oxide Line
- 1 Wabash 4 Opening Vacuum Press
- 1 Wabash 2 Opening Press
- 2 PHI 2 Opening Presses
- 1 Circuit Machine Model 7500 Saw
- 1 Multiline Pinning System
- Min Board Thickness: 0.005”
- Max Board Thickness: 0.250”
- Min Core Thickness: 2.5 mils
- Min Prepreg Thickness: 2.0 mils
- Thickness Tolerance: +/- 10%
Drill Area
- 1 Tennsmith 48” Power Shear
- 2 Barnaby Stackmaster
- 1 Excellon MK-6 Drill
- 1 Excellon MK-5 Drill
- 2 Excellon XL-5 Drill
- 1 Chemcut Model 547 Deburr System
- Size: PTH +/- 3 mils, NPTH +/- 2 mils
- Specific Tooling Holes: +/- 1 mil
Imaging Area
- 1 Somaca Scrubber
- 3 Dry Film Laminators
- 2 Colight Exposure units
- 1 ORC 5 KW Exposure Unit
- 1 Multiline Thin Core Punch
- 1 VCM Vertical Developer
- Layer to Layer + – 3 mils
- Front to Back: +/- 2 mils
- Soldermask: +/- 2 mils
- Hole to Pad: +/- 5 mils (I/L tangency)
- Hole to Pad: +/- 5 mils (O/L tangency)
Plating Area
- 1 Eidschun Shadow Line
- 1 Custom Copper Plating Line
- 1 Marseco Etcher
- 1 Custom Dry Film Stripping Line
- 1 Custom Tin Lead Stripping Line
Soldermask and Legend Area
- 3 Precision Screening Tables
- 1 Gyrex LPI Soldermask Sprayer
- 1 DP-10 Soldermask
- Screening Unit
- 1 Soldermask Exposure Unit
- 1 Chemcut Model 547 Scrubber
- 3 Soldermask Curing Ovens
- 2 VCM Vertical Developer
- Per IPC-SM-840
- LPI Types: Probimer 77 & Taiyo PSR4000
- Wet Types: Dexter SR-1000 & SR-1020
- Solder Mask Colors: green, Blue, Red, Clear, Black & White
- Legend Colors: White, Black & Yellow
Surface Finish Area
- 1 Hot Oil Reflow Line
- 1 Hot Air Leveling Line
- 1 Deep Gold Panel Planting Plating Line
- 1 Electroless Ni / Au Immersion Line
- 1 Immersion Tin Line
- SMOBC (soldermask over bare copper)
- HASL (hot air solder leveling)
- Fused Tin/ Lead Plating
- Electroless Nickel / Immersion Gold
- Electrolytic Nickel / Gold
- Immersion Tin (Omikron)
- Carbon Ink: 20 OHMS
Fabrication Area
- 3XL-3 Driller Pouters
- 3 Barnaby Scoring Machines
- 1 Acuscore CNC Scoring Machine
- 1 Bevel master
- 1 Marseco Final Clean Machine
- Routing: Individual or Panelized Array
- Scoring: Profiles & Route/ Score Combinations
- Countersinks, Counterbores, Beveling & Edge Mining
- Board Edge & Slots: Plated & Non-plated
Inspection And Test
- 4 Inspection Work Stations
- 1 Camtek 2V50P AOI
- 2 Bausch & Lomb Stereo Microscopes
- 1 LIXI X-ray Unit
- 1 Beta Back Scatter Measurement Unit
- 1 Comac Board Dryer
- 3 Mania Flying Probe Testers
- 1 Trace 924 Single Access Tester
- 1 Everett Charles 9090 Dual Access Tester
- Net List Testing per IPC-356D
- Test Voltage: 100-250-volts
- Continuity Resistance: 10-20 ohms
- Isolation Resistance: 2-30 megaohms
- Minimum SMT Pitch: 0.5 mm
Analysis Laboratory
- 1 Complete Wet Analysis Laboratory
- 1 Complete Micro Section Laboratory
- 1 Perkins-Elmer AA Spectrophotometer
- 1 Versamet
- 2 1000X Microscope
Support Area
- 1 Memtek Water Management System
- 1 Simpson Sludge Filter Press
- 1 Sulliar 50 HP Air Compressor
- 1 Worthington 30 HP Air Compressor
- 1 LeRoi 40 HP Air Compressor
- 1 Ingersoll-Rand 75 HP Air Compressor
- 1 Trane 15 Ton Air Chiller
- 1 RSD 15 Ton Air Cooling Tower
- 2 Spencer 15 HP Vacuum Systems
Board Types
- Type II Single & Double Sided
- Type III Multilayer through 24 layers Blind & Buried Vias
- Plugged Vias (Conductive Ink)
- Minimum Finished Via Size: ): 0.006”
- Maximum Hole Aspect Ratio: 12:1
- Minimum Line Width: 0.004”
- Minimum Spacing: 0.004”
- Edge to Edge +/- 5 mils
- Tooling Holes to Edge +/- 4 mils