Our Capabilities

We Specialize in Printed Circuit Board Manufacturing and Quick turn PCB Prototype Fabrication:

Looking for PCB Manufacturers? Look no further, Avanti Circuits provides high quality USA made quick turn PCB Manufacturing. We understand how important it is to our customers that we deliver their PCB’s on time, so they can launch their product faster and more efficiently. As a leading PCB supplier, we have diverse capabilities for any type of PCB Fabrication challenge that you can throw at us. As a PCB company, we have over thirty one years of experience providing simple and full prototype printed circuit boards for thousands of businesses around the world. We can manufacture up to five thousand Full production printed circuit boards without NRE minimums or contracts. This provides your company with more flexibility and options for your PCB fabrication specifications.

Need a high quality PCB prototype and production with quick turnaround? Get a custom quote by going to Request Custom Quote.

Below is a list of Avanti Circuits PCB manufacturing capabilities. We accept PCB files in Gerber 274X file format. All PCB files should be sent in a zip-format and sending a readme file is recommended.

Layer Count
0-24 Layers

FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013

Thermo Set and PSA Based Aluminum
Stainless Steel

Final Thickness
2 Layer – Min .005” Max .250” 14 Layer – Min .054” Max .250”
4 Layer – Min .015” Max .250” 16 Layer – Min .062” Max .250”
6 Layer – Min .025” Max .250” 18 Layer – Min .093” Max .250”
8 Layer – Min .031” Max .250” 20 Layer – Min .125” Max .250”
10 Layer – Min .040” Max .250” 22 Layer – Min .125” Max .250”
12 Layer – Min .047” Max .250” 24 Layer – Min .125” Max .250”

Core Thickness
Min .0025”

Maximum Board Size
2 Layer 18” x 28” Mulitlayer 16” x 26”

Finish Plating
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink

Finished Copper – Outer Layers
1oz Cu – Min .004” Trace/Space 4oz Cu – Min .010” Trace/Space
2oz Cu – Min .005” Trace Space 5oz Cu – Min .012” Trace/Space
3oz Cu – Min .008” Trace/Space

Finished Copper – Inner Layers
.5oz Cu – Min .004” Trace/Space 3oz Cu – Min .010” Trace/Space
1oz Cu – Min .005” Trace/Space 4oz Cu – Min .012” Trace/Space
2oz Cu – Min .006” Trace/Space

Inner Layer Clearances
Min .008”
Minimum Finished Hole Size
Final Thickness <=.062” – .006’ Hole Final Thickness .150” – .014” Hole
Final Thickness .093” – .010” Hole Final Thickness .200” – .018” Hole
Final Thickness .125” – .012” Hole Final Thickness .250” – .020” Hole

Gold Fingers
1 to 4 edges

Soldermask Type
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask

Soldermask Colors
Green/Green Matte White
Black/Black Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix

Silkscreen Type
Thermal Cure Epoxy Ink LPI Ink

Silkscreen Colors
White Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix

CNC Functions
Scoring Edge to Edge Plated Counterbores
Skip Scoring – .250” Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks

Other Services
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Soldermask Plugged Vias Via Caps (Soldermask)
Conductive Filled Vias

Quality and Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm

PTH Hole Size – +/- .002” Front to Back – +/- .002”
NPTH Hole Size – +/- .001” Soldermask – +/- .002”
Tooling Holes – +/- .001” Hole to Pad – +/- .005”